2026-10-20 · 今日论文

YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2026

Three-dimensional (3D) integration continues to advance Moore's Law by facilitating dense interconnects and enabling multi-tier system architectures. Among the various integration approaches, Cu-Cu hybrid bonding has emerged as a leading so…

Benchmarking and Dissecting the Nvidia Hopper GPU Architecture

Proceedings - IEEE International Parallel and Distributed Processing Symposium · 2024

Graphics processing units (GPUs) are continually evolving to cater to the computational demands of contemporary general-purpose workloads, particularly those driven by artificial intelligence (AI) utilizing deep learning techniques. A subst…