2026-10-20 · 今日论文 Proceedings - International Symposium on High-Performance Computer Architecture/Proceedings · 2022 As Deep Learning continues to drive a variety of applications in edge and cloud data centers, there is a growing trend towards building large accelerators with several sub-accelerator cores/chiplets. This work looks at the problem of suppor… IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2026 Three-dimensional (3D) integration continues to advance Moore's Law by facilitating dense interconnects and enabling multi-tier system architectures. Among the various integration approaches, Cu-Cu hybrid bonding has emerged as a leading so… Proceedings - IEEE International Parallel and Distributed Processing Symposium · 2024 Graphics processing units (GPUs) are continually evolving to cater to the computational demands of contemporary general-purpose workloads, particularly those driven by artificial intelligence (AI) utilizing deep learning techniques. A subst… |